Samsung Plans to Release 5GB DDR512 Modules
Currently, the most powerful DDR4 modules on the market are 128GB and 256GB modules, which consist of four TSV layers, and Samsung plans to double this and produce 5GB DDR512 modules, which consist of 8 TSV layers.
The production of new DDR5 modules with twice the number of TSV layers will be made possible by reducing the thickness of a single TSV layer by 50%. Of course, in order for the modules to work, it cannot end with a simple hatching of one layer. Modules must be properly powered and cooled. With more efficient voltage regulators, the new memory modules will run at 1,1V, and the denser TSV layers will allow better heat dissipation from the system to the heatsinks.
The predicted efficiency improvement of DDR5 modules over DDR4 is around 85%, but this is not the first claim we've seen regarding expected performance gains, so we're a bit skeptical about this claim.
According to Samsung, the full transition to DDR5 modules should occur at the turn of 2023/2024. By that time, all processor and motherboard manufacturers will prepare their solutions, and we will see firsthand whether the new DDR5 modules really offer such capabilities. gigantic increase in performance.